Wafer cutting a good partner linear motor, why would say that, because the wafer cutting machine is a very sophisticated equipment, the accuracy is very high, but there is no linear motor, the accuracy may not reach, the following Tongmao Motor from its principle to analyze for you:

1. Wafer cutting machine structure: control system, sports system, optical system, water cooling system, exhaust and blowing protection system, etc.,

2. Principle: Choose industrial laser as light source, using linear motor precision positioning platform, CCD image monitoring positioning, the semiconductor wafer cutting;

3. Wafer cutting features: repeat positioning accuracy and absolute positioning accuracy and to allow the positioning of the stability requirements are very high;

Linear motor table positioning accuracy of up to 2um, so in the motion drive must be used to drive linear servo drive common AC servo and screw frame;

4. Wafer cutting machine is a very sophisticated equipment, its spindle speed between 30,000 to 60,000 rpm, due to the small grain of grain and the grain is very fragile, so the accuracy of wafer cutting machine The requirement is very high, on the wafer cutting machine, the motion control platform has a very high demand for the flatness of the cutting table requirements, less than 10um, if not ideal flatness will cause the laser in the plane of the focal length is inconsistent, so cutting depth inconsistent ;

5.Tongmao linear motor can meet the accuracy requirements of the premise, according to customer requirements for a variety of platform combinations to achieve high-precision motion control.
This article originates from Kunshan Tongmao Electronics Co., Ltd. (www.tmmotion.com) original company, please indicate the source.